To promote the rapid and healthy development of China’s automotive electronics industry, foster innovation and integration in automotive electronics technology, and build an open and collaborative automotive electronics industry ecosystem, the ‘2019 (7th) Automotive Electronics Technology Innovation and Industrial Cooperation Forum’, co-organised by the Automotive Electronics Technology Branch of the Society of Automotive Engineers of China, the Brake Committee of the China Association of Automobile Manufacturers, the Shanghai Society of Automotive Engineers, and the Integrated Circuit Design Industry Technology Innovation Strategic Alliance, is scheduled to take place on 24 May at the Crowne Plaza Lingang Dishuihu, Shanghai.
Under the theme ‘The Future of Automotive “Chips”’, the forum will address the significant opportunities presented by the transformation towards vehicle electrification, intelligence and connectivity. Discussions will centre on accelerating the research and development of core automotive electronic chips and sensors, advancing industrialisation and practical implementation, and promoting rapid corporate growth through technological innovation and industrial capital. Particular attention will be paid to new trends, technologies and developments in areas such as chips and key components, AI and autonomous driving, standards and testing, and industrial investment and financing.
SGR Microelectronics is a leading domestic innovator and application provider of millimetre-wave radar technology. The company has developed millimetre-wave radar chips and modules for ADAS systems in smart vehicles, and has launched the first highly integrated 24GHz radar SoC with independent domestic intellectual property rights. Furthermore, the company is currently developing a series of highly integrated products operating at 24GHz and 77/79GHz. At this forum, Sijie Microelectronics will showcase its ADAS millimetre-wave radar chips, as well as a selection of IoT radar application solutions, in the exhibition area.
Stand location: No. 9. We look forward to welcoming you there.
Appendix: Event agenda.
23 May: Afternoon – Symposium on the Development of the Automotive and Components Industry in the Shanghai Lingang Park, followed by a welcome dinner;
24 May: Morning – Summit Forum: Trends, Opportunities and Challenges;
24 May: Afternoon – Specialised Forums
Session 1: Intelligent, Connected and Autonomous Driving
Session 2: Industry and Investment Forum
Closed-door session: Innovative Enterprise Products