On 24 May, the Automotive Electronics Innovation Forum (AEIF), themed ‘The Future of Automotive “Chips”’, was successfully held in Shanghai. Building on the rapid development of autonomous driving and connected vehicle technologies, this year’s forum centred on discussions regarding how to accelerate the research and development of core automotive electronic chips and sensors, advance industrialisation and practical implementation, and promote rapid corporate growth through technological innovation and industrial capital. Participants included representatives from government departments, industry experts, vehicle manufacturers, Tier 1 suppliers, automotive chip manufacturers and investment specialists.
Shanghai Sijie Microelectronics participated in this Automotive Electronics Forum and showcased its automotive ADAS broadband millimetre-wave radar chip and module solutions. Sijie Microelectronics displayed a range of radar chip products that have passed AECQ-100 verification, such as the 1-transmitter, 2-receiver SRK1201L and the 1-transmitter, 1-receiver SRK1102A. These chips support a wide range of automotive ADAS functions, including Blind Spot Detection (BSD), Lane Change Assist (LCA), Rear Cross-Traffic Alert (RCTA), Door Opening Warning (DOW), and long-range detection.
To accelerate the integration and innovation of automotive electronics technology, the conference organising committee focused on promoting a selection of outstanding innovative enterprises and products, and fostering their collaborative application with vehicle systems. To this end, it organised the ‘2019 Automotive Electronics Innovative Enterprises and Products’ selection event in collaboration with the Integrated Circuit Design Industry Technology Innovation Alliance, the Automotive Electronics Technology Branch of the Society of Automotive Engineers of China, the Shanghai Society of Automotive Engineers, and the editorial office of *China Integrated Circuits* magazine. Shanghai Sijie Microelectronics’ 24GHz millimetre-wave radar chip was awarded the 2019 ‘Automotive Electronics Innovation Product Award’!
Cheng Jinge, Secretary-General of the National Integrated Circuit Design Industry Technology Innovation Alliance, also noted in his address: “ At present, 60–70 per cent of technological innovation in the automotive industry is driven by automotive electronics, with chips forming the core of vehicle intelligence. With the advent of the era of intelligent vehicles, connected vehicles, safe vehicles and new energy vehicles, automotive chips have become one of the key drivers ensuring the steady and sustainable development of the IC industry.” Shanghai Sijie Microelectronics will also contribute its efforts to the development of domestically produced automotive electronic chips.